The Silicon Carbide Manufacturing Process Could Change the Future of Power Electronics

The current silicon carbide manufacturing process uses a batch tool with low throughput and limited capacity. This technology can handle smaller wafers, but as the silicon carbide industry grows, it will need larger processes that can handle larger wafers. Currently, the batch tool is limited to 12 150 mm or nine 200 mm wafers. Once this new process becomes available, the industry will have to adjust to the new method.

Impregnation/polymerization/pyrolysis cycle to produce more silicon carbide inside the pores of silicon carbide tiles and bars

In the impregnation/polymerization-pyrolysis cycle, carbonaceous carbon (C) is mixed with a liquid carbon precursor and allowed to diffuse into porous silicon carbide preforms. The result is a more dense, crystalline form of silicon carbide, with a reduced open porosity.

The BJP process is an additive manufacturing technique that allows for the fabrication of highly complex geometrical shapes. This process produces parts with higher density and lower porosity compared to traditional compaction moulding. The resultant parts are also suited for secondary treatments.

The process was used to create a densified silicon carbide material by filling residual porosity in silicon carbide tiles and bars. The polymerized material was then heated to 1600deg C and converted to SiC preform inside the silicon carbide pores. This process was repeated five times in total. The final densification produced silicon carbide samples with superior properties.

Noise from silicon carbide

Silicon carbide is a chemical compound made up of silicon and carbon. It naturally occurs as moissanite, but has been synthesized and mass produced for more than a century. It has multiple applications, from abrasives for grinding wheels to ceramics for automotive applications. It is also used in bulletproof vests. And now, it could change the world of power electronics.

One way to reduce the noise in the manufacturing process is to improve the material's properties. A sound-absorbing silicon carbide material is able to reduce noise at low frequencies and absorb sound in other frequency bands. The material is able to reduce this noise with the help of a special etching technique.

The material can be produced in many ways, including binder jetting AM, spray drying, and pyrolysis. A variety of techniques are used to create spherical silicon carbide powder. We studied the effect of various methods on the microstructure of the material.

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